Apple is in discussions with several Indian semiconductor companies about the potential assembly and packaging of components used in iPhone devices, according to people familiar with the matter. The talks are at an early stage and form part of Apple’s broader efforts to expand its manufacturing footprint in India.
If concluded, the discussions would mark Apple’s first move to have chip related assembly and packaging work carried out in India. Industry sources say one of the companies involved is CG Semi, which is building a semiconductor assembly and testing facility in the western Indian state of Gujarat.
It is not yet clear which specific components would be handled in India, though display related chips are seen as likely candidates during the initial phase. Any final arrangement would depend on the readiness of local facilities to meet Apple’s technical and quality requirements.
Apple and the Indian firms involved have declined to comment on the reported negotiations. One company said it does not respond to market speculation and would disclose details only if a formal agreement is reached.
The potential move aligns with Apple’s strategy to diversify its global supply chain and reduce dependence on a single manufacturing region. The company has been steadily increasing iPhone production in India and aims to make the country a major manufacturing hub for devices sold internationally within the next few years.
Establishing chip assembly and packaging operations in India could also support the country’s ambitions to build a domestic semiconductor ecosystem. Analysts say such a step would strengthen India’s role in global electronics manufacturing while helping Apple build a more resilient and geographically balanced supply chain.
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